Capabilities

Skilled personnel and sophisticated equipment provide the versatility needed for assignments that range from small prototype quantities to large production runs. All facilities are centrally located in a modern 50,000 square foot building, designed for efficient performance over a wide range of thin film requirements.

• Electron Beam Evaporation
• R.F. and D.C. Magnetron Sputtering
• Ion Beam Assisted Deposition
• Reactive Sputtering
• Photolithic Patterning
• Gold Electroplating
• Substrate Diamond Sawing
• Stylus Profilometer and Spectrophotometer Measurement of Thin Films
• Complete Machine Shop For Custom Tooling
• Prototype R&D/High Volume Production
• Compliance With Mil Specs

Applications

• Metallized Ceramic, Metal, Plastic, and Glass Substrates
• Electronically Conductive Transparent Coatings
• Optical Coatings/Lasers/Electro-Optical Coatings
• Microwave Hybrid Conductor/Resistor Circuits
• Conductive Sputtered & Plated-Through Via Holes in Substrates
• Thin Film Thickness and Optical Standards