Dicing
Programmable
step and repeat saw capability allows:
- Dicing of up to 8" square ceramic, glass and semiconductor substrates.
- A broad range of kerf widths with location accuracy of better than .0004 inch.
- Large volume, quick delivery.
Deposition
| Substrate Patterning
| Dicing | Pricing
About Us | News & Events | Contact Us | Home
© 2005 by
Thin Film Technology, Inc.
All Rights Reserved. Text, graphics, and HTML code are protected by US
and
International Copyright Laws, and may not be copied, reprinted, published,
translated, hosted, or otherwise distributed by any means without explicit
permission.
Thin Film Technology, Inc.
153 Industrial Way
Buellton, CA 93427
805.688.4949
805.688.8487 fax