Substrate Patterning For Passive Microelectronics & Other Applications

Thin Film Technology's substrate patterning division uses etchback, liftoff, and plating techniques to generate high-resolution patterns on Alumina, Beryllia, Ferrite, Fused Quartz, and Silicon substrates for conductor/resistor hybrid applications, with plated-through via holes or edge metalization. Our patterning capabilities offer resolution to .0001 inch using customer-supplied photomasks or photomasks designed in-house.

Routine support services include diamond sawing capability of up to 6" square ceramic, glass and semiconductor substrates and gold electroplating.

See layout guidelines for a detailed overview of values, tolerances and edge capabilities.