Metallized Substrates

Custom Etched Circuits

Typical Substrates Available

ALUMINA	ALN	BEO
FERRITE	GLASS	SILICON
As fired or polished in various thicknesses.

Typical Metallization Available

DC Magnetron		TaN	-	30-100 Ohms per square
RF Bias				TCR - 100 ± 25 ppm/c
Multi Targets		TiW	-	Adhesion Layer
Plated Thru Vias		Ni	-	Barrier Layer
		Au	-	Sputtered and Upplated

Patterning

.0006 Lines and Spaces

Tolerance ± .0001

Front to back registration ± .002

Photo-Definable Polyimide

Mask Sets
Customer-supplied or we can provide them to your specifications.

Inspection
Stability, TCR, adhesion, resistance and other critical circuit measurements are recorded on each lot to ensure quality products. Processes are in accordance with:

MIL-STD-883D, MIL-STD-45662A, MIL-I-45208C, MIL-STD-105E, & MIL-STD-454.

Traceability
Data with circuits includes traceability to substrates, metallization, and material. Available on request.

Research & Development
Flexible capabilities for prototype circuits.